Launched MediaTek Dimensity 8100, Dimensity 8000, Dimensity 1300 chipsets: All details

The MediaTek Dimensity 8100 and Dimensity 8000 chipsets were announced by the company on Tuesday. The company’s new chipsets are aimed at the flagship segment and will go up against Qualcomm’s Snapdragon 888 SoC. The launch of the new chip comes four months after the launch of the 4nm MediaTek Dimensity 9000 SoC and smartphones with this chipset are expected to take place in the coming weeks. Meanwhile, the chipmaker also announced the launch of the MediaTek Dimensity 1300 SoC, which is an upgraded version of the company’s Dimensity 1200 chipset launched last year.

The company revealed on Tuesday that MediaTek The Dimensity 8100 and Dimensity 8000 chipsets will feature four Cortex-A78 performance cores and four Cortex-A55 efficiency cores, along with the Mali G610 MC6 GPU. The performance cores on the Dimensity 8100 offer speeds of 2.85GHz, while the Dimensity 8100 offers up to 2.75GHz. Dimensity 8100 and Dimensity 8000 are built on TSMC’s 5nm process.

Both chipsets feature MediaTek’s HyperEngine 5.0 technology for increased efficiency and frame rates – up to 120 fps for the MediaTek Density 8100 and 140 fps for the Dimensity 8000 SoC. Meanwhile, the chipsets also support LPDDR5 RAM and UFS 3.1 storage, according to the company.

Chipsets with MiraVision 780 display engine and smartphones powered by these chipsets can support refresh rates up to 168Hz at full-HD+ (1,080×1,920 pixels) resolution, while The MediaTek Dimensity 8100 SoC will also support a 120Hz refresh rate at WQHD+ (1,440 x2,560 pixels resolution). The Dimensity 8000 chipsets are backed by a 5 gigapixel per second ISP for quick HDR photo and video capture, according to MediaTek.

Both the MediaTek Dimensity 8100 and Dimensity 8000 chipsets will feature an Imagiq 780 ISP with 200-megapixel camera support and support for HDR10+ video recording at 4K resolution at 60 fps. They will offer HDR video recording with simultaneous dual cameras on the front and rear cameras, or two rear camera lenses.

Similarly, both chipsets will provide 5G Connects to an R16-ready 5G modem that provides 2CC cellular network aggregation and the company’s UltraSave 2.0 energy-saving feature. However, like the MediaTek Dimensity 9000 SoC, these chipsets do not support mmWave 5G connection. Both the MediaTek Dimensity 8100 and Dimensity 8000 chipsets support Wi-Fi 6E and Bluetooth 5.3 connectivity, according to the company.

MediaTek also announced the launch of Density 1200 The SoC is the successor to the 6nm Dimensity 1200 chipset launched last year. This chipset features an ARM Cortex-A78 high-performance core clocked at 3GHz, three performance Cortex-A78 cores, and four Cortex-A55 efficient cores.

Smartphone enthusiasts won’t have to wait long as the MediaTek Dimensity 8100, Dimensity 8000 and Dimensity 1300 chipsets will launch on smartphones in “first quarter of 2022” from several “phone brands”. world’s largest smart,” according to the company.